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| ADE-208-287 (Z) 2SH14 Silicon N-Channel IGBT 1st. Editon Feb. 1995 Application TO-3P High speed power switching Features * High speed switching * Low on saturation voltage 1 2 3 1 2 3 1. Gate 2. Collector 3. Emitter Table 1 Absolute Maximum Ratings (Ta = 25C) Item Collector to emitter voltage Gate to emitter voltage Collector current Collector peak current Collector dissipation Channel temperature Storage temperature Symbol VCES Ratings 600 20 30 60 100 150 -55 to +150 Unit V V A A W C C -------------------------------------------------------------------------------------- -------------------------------------------------------------------------------------- -------------------------------------------------------------------------------------- -------------------------------------------------------------------------------------- ic(peak) PC* Tj IC VGES -------------------------------------------------------------------------------------- -------------------------------------------------------------------------------------- -------------------------------------------------------------------------------------- Tstg -------------------------------------------------------------------------------------- * Value at Tc = 25C 1 2SH14 Table 2 Electrical Characteristics (Ta = 25C) Item Collector to emitter breakdown voltage Zero gate voltage collector current Gate to emitter leak current Gate to emitter cutoff current Collector to emitter saturation voltage Collector to emitter saturation voltage Input capacitance Symbol V(BR)CES ICES IGES Min 600 Typ -- Max -- Unit Test conditions V IC = 100 A, VGE = 0 VCE = 600 V, VGE = 0 VGE = 20 V, VCE = 0 -------------------------------------------------------------------------------------- -------------------------------------------------------------------------------------- -- -- 0.5 mA -------------------------------------------------------------------------------------- -- 3.0 -- -- -- 2.0 1 5.0 -- A V V -------------------------------------------------------------------------------------- -------------------------------------------------------------------------------------- VCE(sat)1 VCE(sat)2 Cies IC = 15 A, VGE = 15 V IC = 30 A, VGE = 15 V VCE = 10 V, VGE = 0, f = 1 MHz IC = 30 A, RL = 10 , VGE = 15 V Rg = 50 VGE(off) IC = 1 mA, VCE = 10 V -------------------------------------------------------------------------------------- -- 2.6 3.3** V -------------------------------------------------------------------------------------- -- 2600 -- pF -------------------------------------------------------------------------------------- Switching time -------------------------------- ton tf -- -- -- 300 300 600 -- 600 1200 tr -- 160 -- ns -------------------------------- -------------------------------- toff **VCE(sat)2 is specified at the correlated test condition (IC=20A) -------------------------------------------------------------------------------------- 2 2SH14 Power vs. Temperature Derating 200 Pc (W) 100 I C (A) Maximum Safe Operation Area 10 0 PW 1 m s =1 s DC (10 m (T O sh s c = pe ot) 25 ratio C n ) 150 10 Collector Dissipation 100 Collector Current 1 50 0.1 Ta = 25 C 0.01 0 50 100 Case Temperature 150 Tc (C) 200 1 10 100 1000 Collector to Emitter Voltage V CE (V) Reverse Bias SOA 100 100 I C (A) Typical Output Characteristics Pulse Test Ta = 25 C I C (A) 80 VGE = 15 V 12 V 10 Collector Current Collector Current 60 40 10 V 1 20 8V 6V Tc = 25 C 0.1 0 200 400 600 800 Collector to Emitter Voltage V CE (V) 0 2 4 6 8 10 Collector to Emitter Voltage V CE (V) 3 2SH14 Typical Transfer Characteristics Collector to Emitter Saturation Voltage V CE(sat) (V) 100 I C (A) 10 Collector to Emitter Saturation Voltage vs. Gate to Emitter Voltage 80 8 I C = 30 A 20 A 10 A Collector Current 60 Tc = -25 C 25 C 75 C 6 40 4 20 Pulse Test V CE = 10 V 0 4 8 12 Gate to Emitter Voltage 16 20 V GE (V) 2 Pulse Test 0 4 8 12 Gate to Emitter Voltage 16 20 V GE (V) Collector to Emitter Saturation Voltage vs. Collector Current Collector to Emitter Saturation Voltage V CE(sat) (V) 50 20 10 5 2 1 Tc =75 C 25 C -25 C Pulse Test VGE = 15 V C (pF) 1000 10000 Typical Capacitance vs. Collector to Emitter Voltage Cies Capacitance Coes 100 V GE = 0 f = 1 MHz Cres 0.5 1 2 5 10 20 50 Collector Current I C (A) 100 100 0 10 20 30 40 50 Collector to Emitter Voltage V CE (V) 4 2SH14 Dynamic Input Characteristics Collector to Emitter Voltage VCE (V) 500 VCC = 400 V 300 V 200 V 20 Gate to Emitter Voltage VGE (V) Switching Characteristics 1000 500 t (ns) td(off) 200 100 50 20 10 1 V CC = 300 V V GE = 15 V Rg = 50 Tc = 25 C 5 10 Collector Current 50 I C (A) 100 tf tr td(on) 400 16 V GE 8 VCC = 400 V 300 V 200 V VCE 0 40 80 120 160 Gate Charge Qg (nc) 0 200 200 100 I C = 30 A 4 Switching Characteristics 1000 500 t (ns) tf 200 100 50 20 10 5 I C = 30 A R L =10 (V CC = 300 V) V GE = 15 V Tc = 25 C 10 50 100 Gate Resistance Rg ( ) 500 tr td(on) td( off ) Switching Time 300 12 Switching Characteristics 1000 500 t (ns) td(off) 200 100 50 I C = 30 A R L = 10 V GE = 15 V Rg = 50 0 25 50 75 100 Case Temperature Tc (C) 125 tr td(on) tf Switching Time Switching Time 20 10 -25 5 2SH14 Normalized Transient Thermal Impedance vs. Pulse Width 3 Normalized Transient Thermal Impedance s (t) 1 D=1 0.5 0.3 0.2 0.1 0.1 0.05 0.02 0 .01 ch - c(t) = s (t) * ch - c ch - c = 1.25 C/W, Tc = 25 C PCM D= PW T 0.03 1s t ho Pu lse PW T 0.01 10 100 1m 10 m Pulse Width 100 m PW (S) 1 10 Switching Time Test Circuit Waveforms 90% 0 10% Ic Monitor Vin V CE Vin Monitor VCE Monitor Rg Vin 15 V RL 90% V CC Ic td(on) ton 10% tr td(off) toff 10% tf 90% D.U.T. 6 2SH14 Package Dimensions 5.0 0.3 Unit : mm 3.2 0.2 5.0 max 1.5 typ * TO-3P 0.5 typ 16.0 max 1.0 typ 14.9 0.2 2.0 typ 20.1 max 1.6 typ 1.4 max 2.0 typ 18.0 0.5 2.8 typ 1.0 0.2 3.6 typ 0.9 typ 1.0 typ 0.6 0.2 0.3 typ 5.45 0.2 5.45 0.2 Hitachi Code EIAJ JEDEC TO-3P SC-65 -- 7 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Copyright (c) Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. |
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